Kingston Value 4GB (4GBx1) DDR4 2666MHz CL19 SODIMM Ram (KVR26S19S6/4)

Feature

• 4GB ( 1x 4GB Module ) | DDR4 2666 MHz ( PC4-21300 ) | DDR4 SODIMM ( 260-Pin ) | Non-ECC SODIMM ( Unbuffered SO-DIMM ) | 1.2V - DDR4 Standard Voltage
• Compatible Equivalent for Kingston KVR26S19S6/4, KCP426SS6/4, HP26D4S9S1ME-4, KKN2NM-MIE
• High performance Memory RAM upgrade designed for Laptop/Notebook/All-in-One Computer Systems
• All modules undergo quality assurance testing to ensure dependable and reliable performance | Please verify the supported memory (RAM) specifications of your system prior to purchase to ensure compatibility
• A-Tech provides a Lifetime Warranty for all orders & offers complimentary United States based Tech Support before, during, & after your purchase

Kingston Desktop and Notebook memory

Kingston offers extremely reliable, high-performance desktop memory and sells more notebook upgrade memory than anyone in the world. Each and every module is customized and tested to meet the exact specification requirements of each system. memory can increase the processing power of your notebook or desktop. It offers a great cost-performance benefit plus better multitasking, faster processing of multimedia files, smoother video streaming and an enhanced gaming experience.

Highlights:

• Compatible with latest motherboard's chipsets
• Lower power consumption than DDR4
• Higher bandwidth capabilities than DDR4
• Reliability and efficiency at the affordable prices

Superior quality and testing Kingston's advanced testing facilities and multi-tiered testing system ensures quality control throughout the design and manufacturing process. All components are qualified and all modules are tested at all stages of production.	Compatible with latest motherboards Compatible with Intel 400 Series Chipsets, 10th Gen Intel Core Processors, AMD 500 Series Chipsets, and AMD Ryzen 3000 Series Processors.	Free customer support Kingston provides free customer support to help with any questions or issues you may have.	Expertise Kingston is involved in the DRAM process from the dicing of the wafer to encasing the integrated circuits and from assembling the module to testing the finished product.