Gigabyte B760M AORUS ELITE GEN5 LGA1700 Motherboard

Gigabyte B760M AORUS ELITE GEN5 LGA1700 Motherboard

Feature

• PCIe Gen5 Performance : Perfect Sync to Win
• Supports Intel® Core™ 14th/ 13th /12th processors
• Efficient Thermal : VRM Thermal Armor Advanced & M.2 Thermal Guard
• EZ-Latch : PCIe 5.0x16 Slot with Quick Release Design
• EZ-Latch Plus : M.2 Connectors with Quick Release & Screwless Design
• PCIe UD Slot : SMD PCIe 5.0 Armor for enhanced graphics card support
• Unparalleled Performance : Twin 12*+1+1 Phases Hybrid VRM Solution
• Dual Channel DDR5 : 4*DIMMs with XMP Memory Module Support
• Fast Networks : 2.5GbE
• Extended Connectivity : Rear USB-C® 20Gb/s, Front USB-C® 10Gb/s, DP, HDMI
• Next Generation Storage : 2*PCIe 4.0 x4 M.2 Connectors
• Smart Fan 6 : Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
• Q-Flash Plus : Update BIOS Without Installing the CPU, Memory and Graphics Card
• High-Res Audio : ALC1220 & High-End Audio Capacitors

The new GIGABYTE B760 motherboards provides the most efficient solution to enjoy boosted performance of PCIe Gen5 on the existing platform. PCIe 5.0 doubles the data transfer rate of PCIe 4.0 from 16 GT/s to 32 GT/s per lane. This substantial increase in bandwidth particularly benefits high-performance graphics cards, storage devices, and AI accelerators that demand faster data movement.

Cooling

Fully Covered Thermal Design

High coverage MOSFET and integrated molding Heatsinks to improve thermal efficiency with better airflow and heat exchange.

4X Large Surface

Increased surface area up to 4X larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs.

Real One-piece Build

TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors' multi-piece design.

Multi-Cut Design

TMOS features several channels and inlets on the heatsink. This design allows for the air flow to go through which leads to a great improvement of the heat transfer performance.

3% Cooler by implementing

2X Copper PCB Design

By adopting 2X copper on PCB inner layer, it lowers the components' temperature at least 3% by turning the PCB into a super thin PCB size copper heatsink to dissipate the heat from the components effectively, due to it’s high thermal conductivity and lower impedance.

Smart Fan 6

Superior cooling performance and whisper-quiet operation for your gaming rig.

Ultra Durable™

Born from Ultra Durable™

Technology embodies our commitment to excellence, providing gamers with a platform that's not only powerful but also built for longevity and reliability. GIGABYTE motherboards are engineered to endure and excel.

Memory

Unlock DDR5 Performance

GIGABYTE is offering a tested and proven platform with extreme memory performance boost.

Optimal VRM Design

Optimal Power

Maximum Turbo Boost and overclocking performance

Twin Hybrid VRM Design

To ensure maximum Turbo Boost and overclocking performance of Intel's new generation CPU, AORUS series motherboard equip the best VRM design ever built with the highest quality components.