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SKU: HX100-16gb-Silver
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With a unique heat-spreader design, Biwin HX100 can decrease the operating temperature by over 5 °Celsius. Equipped with premium ICs and an unlocked PMIC for higher voltage, HX100 is capable of one-click overclocking with data rates of up to 6000 MT/s, supporting XMP 3.0 and AMD EXPO.
Biwin HX100 won the “Oscars” of the design world– the German Red Dot Award for exceptional design aesthetic. It possesses seven cooling fins for heat dissipation as well as a tough texture.
The special design of Biwin HX100 for optimized heat dissipation features a high-efficient thermal conductive silicone pad and the highest-grade aluminum heat spreader with parallel cooling fins, forming an armor that combines aesthetics with cooling efficiency. The high-efficient thermal conductive silicone pad is closely attached to the memory ICs, rapidly transferring heat to the heat spreader. All of these features help HX100 decrease the operating temperature by over 5 °Celsius.
With gaming-grade performance, high data rates, and low latency, Biwin HX100 is designed for overclockers and gaming enthusiasts, and is capable of intense competitions.
Biwin HX100 is built with premium ICs selected automatically, setting a strong foundation for high performance and great overclocking potential.
| Specification | Details |
|---|---|
| Model Name | Biwin Black Opal HX100 |
| RAM Type | DDR5 Heatsink UDIMM |
| Color | Silver |
| Capacity | 16gb x1 |
| Data Rate | 6000 MHZ |
| Timing | cl36 |
| Pin | 288 Pin |
| Dimensions | 136.60 x 47.00 x 8.40 mm |
| Operating Temperature | 0°C to +85°C |
| Storage Temperature | -40°C to +85°C |
| Certifications | FCC, CE, KCC, BMSI, RCM, WEEE, RoHS, UKCA, VCCI |
| Warranty | Limited Lifetime* |
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