ASRock B850 STEEL LEGEND WIFI AM5 AMD ATX Motherboard

ASRock B850 STEEL LEGEND WIFI AM5 AMD ATX Motherboard

Feature

• Supports AMD Socket AM5 Ryzen 9000, 8000 and 7000 Series Processors
• 14+2+1 Phase Power Design, 80A Dr.MOS for VCore+SOC
• 4 x DDR5 DIMMs Supports Dual Channel, up to 8000+ (OC)
• 1 PCIe 5.0 x16, 1 PCIe 4.0 x16
• Graphics Output Options: 1 HDMI
• Realtek ALC4082 7.1 CH HD Audio Codec, Nahimic Audio
• 1 Blazing M.2 (PCIe Gen5x4), 3 Hyper M.2 (PCIe Gen4x4), 4 SATA3
• 1 USB 3.2 Gen2x2 Type-C (Front), 4 USB 3.2 Gen2 (2 Rear, 2 Rear Type-C), 7 USB 3.2 Gen1 (3 Rear, 4 Front), 8 USB 2.0 (4 Rear, 4 Front)
• Realtek 2.5G LAN
• 802.11be Wi-Fi 7 + Bluetooth
• Supports Lite Release Design, Toolless Multi-Layer M.2 Heatsink, M.2 Bottom Heatsink

ASRock B850 Steel Legend WiFi

Steel Legend represents the philosophical state of rock-solid durability and irresistible aesthetics. Built around most demanding specs and features, the Steel Legend series aims at daily users and mainstream enthusiasts! Providing a strong array of materials/components to ensure a stable and reliable performance.

Exclusive 20K Cap with 1000uF Capacitance

The upgraded 20K Black capacitor not only extends the lifespan to 20,000 hours but also increases the capacitance value from 560uF to 1000uF, bringing several benefits:

• Higher Capacitance: Greater charge storage for better support under high loads.
• Lower Ripple: Reduced power output fluctuations, improving quality.
• More Stable Output Current: Stable power supply, minimizing voltage impacts.
• Better Performance & System Stability: Increased reliability and consistent performance.

14+2+1 Power Phase Design

Featuring sturdy components and completely smooth power delivery to the CPU. Plus, it offers unmatched overclocking capabilities and enhanced performance with the lowest temperature for advanced gamers as well.

Dr. MOS

Dr.MOS is the integrated power stage solution which is optimized for synchronous buck-set down voltage applications! Compared to traditional discrete MOSFETs, it intelligently delivers higher current for each phase, thus providing improved thermal result and superior performance.

Hi-Density Power Connector

CPU overclocking requires higher current. ASRock Hi-Density Power Connectors are designed to withstand higher currents compared to traditional CPU and ATX power connectors, providing a more stable system and reducing the risk of fire during heavy overclocking.

8 Layer PCB design

The 8 Layer PCB provides stable signal traces and power shapes delivering lower temperature and higher energy efficiency, ensures a reliable and long-lasting system while delivering ultimate performance without any compromise.

DDR5 XMP & EXPO Support

Derived from the “built for stable and reliable” designing concept, ASRock does not compromise on any details. This motherboard is built with high quality materials, enthusiasts are able to enjoy the boost of DDR5 memory overclocking performance by enabling the pre-tested profiles. Make sure the memory modules are Intel® XMP/AMD EXPO™ capable and overclocking can be made so affordable, satisfying and absolutely no sweat at all.

* There are certain risks involved with memory overclocking and may affect your system’s stability. Please realize that overclocking should be done at your own risk and expense. EXPO/XMP profile support may vary by different system configuration, memory modules and motherboard models. Please refer to Memory QVL for the completed support list.

PCIe Gen5 Blazing M.2

The Blazing M.2 accommodates the latest PCI Express 5.0 standard to perform twice the bandwidth compared to previous generation, with a breathtaking 128Gb/s transfer speed, it is ready to unleash the full potential of future ultrafast SSDs.

Hyper M.2 Gen4 x4

Supports PCI Express 4.0 M.2 SSDs, it is capable of perform twice the speed compared to previous 3rd generation, giving a lightning fast data transferring experience.

M.2 Heatsink Toolless Design

Besides the M.2 SSD toolless design on the motherboard, ASRock up a notch by introducing this industry first M.2 heatsink quick release mechanism on the motherboard. The user friendly toolless design helps installing M.2 SSD super easy & simple.

XXL M.2 Heatsink

The extra large aluminum alloy M.2 heatsink effectively improves heat dissipation to keep those high speed M.2 SSDs as cool as possible, it is able to give better stability while maintaining top performance.

Wi-Fi 7

Enhanced VR Experience

Wi-Fi 7 offers higher data throughput, lower latency, and Multi-link Operation. These features ensure a smooth and real-time interactive experience, making the VR/AR experience more immersive and connected.

Wi-Fi 7 802.11be

Latest WiFi 7 technology delivers extreme wireless internet speeds and low latency, with higher throughput and Multi-RU as well as puncturing technology. The new WiFi 7(802.11be) technology is able to accelerate cloud-based gaming, 8K video streaming, and video conferencing.

Dragon 2.5 Gb/s LAN

The intelligent 2.5Gb/s LAN platform is built for maximum networking performance for the demanding requirements of home networking, content creators, online gamers and high-quality streaming media. Boost networking performance up to 2.5X the bandwidth compared to the standard gigabit Ethernet, you’ll enjoy the faster and uncompromised connectivity experience for gaming, file transfers and backups.

Front Panel USB 3.2 Gen2x2 Type-C Header

The latest USB 3.2 Gen2x2 Type-C delivers up to 20 Gbps data transfer rate which is 2x as fast as previous generation, providing a blazing fast data transfer interface with reversible USB Type-C design that fits the connector either way.